2021-2026 팬아웃 패키징 재료 및 장비 시장 (Fan-Out Packaging Materials and Equipment Market 2021-2026) 2023-2028
가격문의(상세정보 참조)
구매평
Q&A
간편결제 가능구매평
Q&A
보고서 주문 후, 연도 업데이트와 커스터마이징을 위해 당사에서 연락드릴 예정입니다.
상세 사항에 따라 가격이 변동될 수 있으니 참고 바랍니다.
기본 보고서는 영문으로 작성되며, PDF,PPT,DOCX(워드) 형식으로 제공 가능합니다.
보고서 전달 후에는 환불이 불가능하오니 양해 바랍니다.
평균 납기는 2주이며, 형식과 내용에 따라 달라질 수 있습니다.
요약
팬 아웃 포장재 및 장비 시장 (2021-2026). 팬 아웃 패키징 재료 및 장비 시장 -Forecast (2023-2028). 글로벌 팬 아웃 포장 재료 및 장비 시장은 2022-2027 년 예측 기간 동안 16.09%의 CAGR로 성장하고 2021 년 약 1,318.2 백만 달러에서 2027 년까지 3,418.7 백만 달러에 도달 할 것으로 추정됩니다.
Summary
Fan-Out Packaging Materials and Equipment Market (2021-2026). Fan-Out Packaging Materials and Equipment Market -Forecast(2023 - 2028). The global Fan-out Packaging Materials and Equipment Market is estimated to grow at a CAGR of 16.09% during the forecast period 2022-2027 and reach $3,418.7 million by 2027, from around $1,318.2 million in 2021
Table of Contents
1. Fan Out Packaging Materials and Equipment Market
1.1 Definitions and Scope
2. Fan Out Packaging Materials and Equipment Market - Executive Summary
2.1 Market Revenue, Market Size and Key Trends by Company
2.2 Key trends By Industry
2.3 Key trends segmented by Geography
3. Fan Out Packaging Materials and Equipment Market – Market Landscape
3.1 Comparative Analysis
3.1.1 Product/Company Benchmarking-Top 5 Companies
3.1.2 Top 5 Financial Analysis
3.1.3 Market Value Split by Top 5 Companies
3.1.4 Patent Analysis
4. Fan Out Packaging Materials and Equipment Market - Market Forces
4.1 Market Drivers
4.2 Market Constraints
4.3 Porters five force model
4.3.1 Bargaining power of suppliers
4.3.2 Bargaining powers of customers
4.3.3 Threat of new entrants
4.3.4 Rivalry among existing players
4.3.5 Threat of substitutes
5. Fan Out Packaging Materials and Equipment Market – By Strategic Analysis
5.1 Value Chain Analysis
5.2 Opportunities Analysis
5.3 Product Life Cycle/Market Life Cycle Analysis
5.4 Suppliers and Distributors (5 Key Suppliers and Their Relevant Distributors)
6. Fan Out Packaging Materials and Equipment Market – By Process Type (Market Size -$Million/Billion)
6.1 Carrier bonding & debonding
6.2 Pick & Place
6.3 RDL Passivation
6.4 Others
7. Fan Out Packaging Materials and Equipment Market – By Type (Market Size -$Million/Billion)
7.1 Core Fan-out
7.2 High-density fan-out
7.3 Ultra high density fan-out
8. Fan Out Packaging Materials and Equipment Market – By Business Model (Market Size -$Million/Billion)
8.1 OSAT
8.2 Foundry
8.3 FDM
9. Fan Out Packaging Materials and Equipment Market – By Application (Market Size -$Million/Billion)
9.1 PMICs, RF Transceivers
9.2 Connectivity Modules
9.3 Audio/Codec Modules
9.4 Radar Modules & Sensors
9.5 Others
10. Fan Out Packaging Materials and Equipment Market - By Geography (Market Size -$Million/Billion)
10.1 North America
10.1.1 U.S
10.1.2 Canada
10.1.3 Mexico
10.2 South America
10.2.1 Brazil
10.2.2 Argentina
10.2.3 Chile
10.2.4 Colombia
10.2.5 Others
10.3 Europe
10.3.1 Germany
10.3.2 France
10.3.3 UK
10.3.4 Italy
10.3.5 Spain
10.3.6 Russia
10.3.7 Netherlands
10.3.8 Others
10.4 APAC
10.4.1 China
10.4.2 Japan
10.4.3 South Korea
10.4.4 India
10.4.5 Australia
10.4.6 Indonesia
10.4.7 Malaysia
10.4.8 Others
10.5 RoW
10.5.1 Middle East
10.5.2 Africa
11. Fan Out Packaging Materials and Equipment Market - Market Entropy
11.1 New product launches
11.2 M&A's, collaborations, JVs and partnerships
12. Fan Out Packaging Materials and Equipment Market - Company Analysis (Market , Product Portfolio, Revenue, Developments)
12.1 SAKOR Technologies
12.2 AVL List GmbH
12.3 Taylor Fan Out Packaging Materials and Equipment
12.4 Dynomerk Controls
12.5 Froude, Inc.
12.6 Company 6
12.7 Company 7
12.8 Company 8
12.9 Company 9
12.8 Company 10
"*Financials would be provided on a best-efforts basis for private companies"
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보고서 주문 후, 연도 업데이트와 커스터마이징을 위해 당사에서 연락드릴 예정입니다.
상세 사항에 따라 가격이 변동될 수 있으니 참고 바랍니다.
기본 보고서는 영문으로 작성되며, PDF,PPT,DOCX(워드) 형식으로 제공 가능합니다.
보고서 전달 후에는 환불이 불가능하오니 양해 바랍니다.
평균 납기는 2주이며, 형식과 내용에 따라 달라질 수 있습니다.
요약
팬 아웃 포장재 및 장비 시장 (2021-2026). 팬 아웃 패키징 재료 및 장비 시장 -Forecast (2023-2028). 글로벌 팬 아웃 포장 재료 및 장비 시장은 2022-2027 년 예측 기간 동안 16.09%의 CAGR로 성장하고 2021 년 약 1,318.2 백만 달러에서 2027 년까지 3,418.7 백만 달러에 도달 할 것으로 추정됩니다.
Summary
Fan-Out Packaging Materials and Equipment Market (2021-2026). Fan-Out Packaging Materials and Equipment Market -Forecast(2023 - 2028). The global Fan-out Packaging Materials and Equipment Market is estimated to grow at a CAGR of 16.09% during the forecast period 2022-2027 and reach $3,418.7 million by 2027, from around $1,318.2 million in 2021
Table of Contents
1. Fan Out Packaging Materials and Equipment Market
1.1 Definitions and Scope
2. Fan Out Packaging Materials and Equipment Market - Executive Summary
2.1 Market Revenue, Market Size and Key Trends by Company
2.2 Key trends By Industry
2.3 Key trends segmented by Geography
3. Fan Out Packaging Materials and Equipment Market – Market Landscape
3.1 Comparative Analysis
3.1.1 Product/Company Benchmarking-Top 5 Companies
3.1.2 Top 5 Financial Analysis
3.1.3 Market Value Split by Top 5 Companies
3.1.4 Patent Analysis
4. Fan Out Packaging Materials and Equipment Market - Market Forces
4.1 Market Drivers
4.2 Market Constraints
4.3 Porters five force model
4.3.1 Bargaining power of suppliers
4.3.2 Bargaining powers of customers
4.3.3 Threat of new entrants
4.3.4 Rivalry among existing players
4.3.5 Threat of substitutes
5. Fan Out Packaging Materials and Equipment Market – By Strategic Analysis
5.1 Value Chain Analysis
5.2 Opportunities Analysis
5.3 Product Life Cycle/Market Life Cycle Analysis
5.4 Suppliers and Distributors (5 Key Suppliers and Their Relevant Distributors)
6. Fan Out Packaging Materials and Equipment Market – By Process Type (Market Size -$Million/Billion)
6.1 Carrier bonding & debonding
6.2 Pick & Place
6.3 RDL Passivation
6.4 Others
7. Fan Out Packaging Materials and Equipment Market – By Type (Market Size -$Million/Billion)
7.1 Core Fan-out
7.2 High-density fan-out
7.3 Ultra high density fan-out
8. Fan Out Packaging Materials and Equipment Market – By Business Model (Market Size -$Million/Billion)
8.1 OSAT
8.2 Foundry
8.3 FDM
9. Fan Out Packaging Materials and Equipment Market – By Application (Market Size -$Million/Billion)
9.1 PMICs, RF Transceivers
9.2 Connectivity Modules
9.3 Audio/Codec Modules
9.4 Radar Modules & Sensors
9.5 Others
10. Fan Out Packaging Materials and Equipment Market - By Geography (Market Size -$Million/Billion)
10.1 North America
10.1.1 U.S
10.1.2 Canada
10.1.3 Mexico
10.2 South America
10.2.1 Brazil
10.2.2 Argentina
10.2.3 Chile
10.2.4 Colombia
10.2.5 Others
10.3 Europe
10.3.1 Germany
10.3.2 France
10.3.3 UK
10.3.4 Italy
10.3.5 Spain
10.3.6 Russia
10.3.7 Netherlands
10.3.8 Others
10.4 APAC
10.4.1 China
10.4.2 Japan
10.4.3 South Korea
10.4.4 India
10.4.5 Australia
10.4.6 Indonesia
10.4.7 Malaysia
10.4.8 Others
10.5 RoW
10.5.1 Middle East
10.5.2 Africa
11. Fan Out Packaging Materials and Equipment Market - Market Entropy
11.1 New product launches
11.2 M&A's, collaborations, JVs and partnerships
12. Fan Out Packaging Materials and Equipment Market - Company Analysis (Market , Product Portfolio, Revenue, Developments)
12.1 SAKOR Technologies
12.2 AVL List GmbH
12.3 Taylor Fan Out Packaging Materials and Equipment
12.4 Dynomerk Controls
12.5 Froude, Inc.
12.6 Company 6
12.7 Company 7
12.8 Company 8
12.9 Company 9
12.8 Company 10
"*Financials would be provided on a best-efforts basis for private companies"
